邀请报告嘉宾Prof. Chingping Wong
Prof. Wong is a member of US National Academy of Engineering in 2000 and also a member of Foreign academician of the Chinese Academy of Engineering in 2013. He is also the Distinguished experts of China integrated circuit materials industry technological innovation strategic alliance. Prof. Wong is a Regents’ Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering, Georgia Institute of Technology (GT) and is Dean & Professor of Electronic Engineering, Faculty of Engineering, The Chinese University of Hong Kong (CUHK). He is also the team leader of the Guangdong Innovation Team for the Advanced Electronic Packaging Materials (SIAT). Professor Wong has published widely with over 1000 technical papers and yielded fruitful research results and holds over 50 US patents. Professor Wong is considered an industry legend and has made significant contributions to the industry by pioneering new materials, which fundamentally changed the semiconductor packaging technology. Professor Wong was awarded numerous international honors, such as being elected as AT&T Bell Laboratories Fellow in 1992, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, member of the US National Academy of Engineering in 2000, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, named holder of the Charles Smithgall Chair (one of the two GT Institute Chairs) in 2005, the GT Outstanding PhD Thesis Advisor Award, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s Monie Ferst Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the IEEE CPMT David Feldman Award in 2009 and Dresden Barkhausen Award in 2012. He has recently received the Pennsylvania State University Outstanding Science Alumni Award.
Topic: Electronic Packaging Technology and Materials