Next Generation Chemical Mechanical Polishing (CMP) Pads

Description:Nextgenerationchemicalmechanicalpolishing(CMP)padsforthesemiconductorandelectronicsindustry.StockpolishofSilicon,GalliumArsenide,IndiumPhosphide,DiskMedia,Glass,SiliconCarbide,SapphireFina

Description:

Next generation chemical mechanical polishing (CMP) pads for the semiconductor and electronics industry.

Stock polish of Silicon, Gallium Arsenide, Indium Phosphide, Disk Media, Glass, Silicon Carbide, Sapphire
Final polish of Silicon, Gallium Arsenide, Indium Phosphide, Disk Media, Glass, Silicon Carbide, Sapphire
Polysilicon CMP, Tungsten CMP, Cooper CMP, Barrier Metal CMP
MEMS CMP, TSV CMP
Polishing after Grinding Process

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