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湖北鼎龙控股股份有限公司
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产品分类 | 二级分类 | 产品名称 | 图片介绍 | 生产厂家 | 产品特征 |
抛光材料 | 抛光垫 | 铜抛光垫 |
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湖北鼎龙控股股份有限公司 |
Chemical Mechanical Polishing Pad:Longer pad life due to low cut rate Balanced performance between Removal Rate and defect Mature product with stable performance Variable grooving design PSA with strong peel strength and excellent thermal stability Sub-pad with outstanding non-absorbency of water Both Non-window and window product can be provided Suitable for both 200mm and 300mm wafers |
抛光材料 | 抛光垫 | 氧化物抛光垫 |
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湖北鼎龙控股股份有限公司 |
Chemical Mechanical Polishing Pad:Longer pad life due to low cut rate Balanced performance between Removal Rate and defect Mature product with stable performance Variable grooving design PSA with strong peel strength and excellent thermal stability Sub-pad with outstanding non-absorbency of water Both Non-window and window product can be provided Suitable for both 200mm and 300mm wafers |
抛光材料 | 抛光垫 | 钨抛光垫 |
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湖北鼎龙控股股份有限公司 |
Chemical Mechanical Polishing Pad:Specially designed pad offers for enhancing Copper performance. Pad polishing pad significantly improves defectivity , dishing and erosion . Longer pad life due to low cut rate Balanced performance between Removal Rate and defect Mature product with stable performance |
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