2023中国半导体材料创新发展大会日程
2023 CHINA SEMICONDUCTOR MATERIALS INNOVATION AND DEVELOPMENT CONFERENCE
4月19日 2023中国半导体材料创新发展大会 2023 ICM China
主旨报告 Keynote Speech
主持人：ICMtia秘书长石瑛
Host: Ying Shi, Secretary General，ICMtia
9:00-9:30 芯粒集成封装的趋势
Trends of Chiplets integrated Packages
郑子企 博士 通富微电子股份有限公司先进封装CTO
Dr. Key. Chung, Advanced Package CTO, TongFu Microelectronics Co., Ltd
9:30- 9:50 中国电动汽车发展给国内功率半导体及材料带来的机遇和挑战
China EV Car Booming – Opportunity for Power Semiconductor
王庆宇博士 上海新傲科技股份有限公司总经理、董事
Dr. Jeffrey Wang, CEO and board member of Simgui Technology
9:50-10:10 先进光刻胶发展趋势与本地多元化供应规划
Development Trends of Advanced Photolithography Materials and Domestic Supply Chain Planning
李冰 北京科华微电子材料有限公司总经理
Benjamin Li, Kempur Microelectronics Inc. CEO
10:10-10:30 集成电路湿法清洗技术
Semiconductor Cleaning and Surface Preparation Technology
报告嘉宾：彭洪修，安集微电子科技（上海）股份有限公司副总经理
Hongxiu Peng,VP, Anji Microelectronics
10:30-10:50 此铜非彼铜也 - 晶粒结构的底层设计和实现
All Copper Is Not Created Equal – Grain Engineering in Electroplating
报告嘉宾：张芸博士 苏州昕皓新材料创始人兼总经理
Dr. Yun Zhang, Founder and CEO，Shinhao Materials LLC
10:50-11:10 中国集成电路材料技术创新路径探索
Exploration on the technological innovation path of IC materials in China
报告嘉宾：俞文杰博士 中国科学院上海微系统与信息技术研究所副所长/上海集成电路材料研究院董事长兼总经理
Dr. Wenjie Yu, Deputy Director，Shanghai Institute of Microsystems and Information Technology, Chinese Academy of Sciences \Chairman and CEO, Shanghai Institute of IC Materials
11:10-11:30 接下来会发生什么？美国晶圆厂扩张趋势及材料供应链展望
What’s Next? US Fab Expansions and the Outlook for Materials Supply Chain
Karey Holland博士TECHCET首席策略师和联合创始人
Karey HollandPh.D., Chief Strategist and Co-Founder, TECHCET
11:30-11:50 中国集成电路制造材料产业现状及发展机遇和挑战
The status and development opportunities and challenges of China IC
manufacturing material industry.
石瑛ICMtia常务副理事长兼秘书长
Ying Shi, Executive Vice Chairman & Secretary General, ICMtia
12:00-13:00 自助午餐Buffet Lunch
14:00-17:00 ICMtia新兴供需交流会（闭门）
ICMtia新兴供需对接会（闭门）
Close Door Meeting
