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Next Generation Chemical Mechanical Polishing (CMP) Pads

Next Generation Chemical Mechanical Polishing (CMP) Pads

来源:
2016/06/23
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Description:

Next generation chemical mechanical polishing (CMP) pads for the semiconductor and electronics industry.

  • Stock polish of Silicon, Gallium Arsenide, Indium Phosphide, Disk Media, Glass, Silicon Carbide, Sapphire
  • Final polish of Silicon, Gallium Arsenide, Indium Phosphide, Disk Media, Glass, Silicon Carbide, Sapphire
  • Polysilicon CMP, Tungsten CMP, Cooper CMP, Barrier Metal CMP
  • MEMS CMP, TSV CMP
  • Polishing after Grinding Process

 

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