Description:
Next generation chemical mechanical polishing (CMP) pads for the semiconductor and electronics industry.
- Stock polish of Silicon, Gallium Arsenide, Indium Phosphide, Disk Media, Glass, Silicon Carbide, Sapphire
- Final polish of Silicon, Gallium Arsenide, Indium Phosphide, Disk Media, Glass, Silicon Carbide, Sapphire
- Polysilicon CMP, Tungsten CMP, Cooper CMP, Barrier Metal CMP
- MEMS CMP, TSV CMP
- Polishing after Grinding Process
