Description:

Next generation chemical mechanical polishing (CMP) pads for the semiconductor and electronics industry.

• Stock polish of Silicon, Gallium Arsenide, Indium Phosphide, Disk Media, Glass, Silicon Carbide, Sapphire
• Final polish of Silicon, Gallium Arsenide, Indium Phosphide, Disk Media, Glass, Silicon Carbide, Sapphire
• Polysilicon CMP, Tungsten CMP, Cooper CMP, Barrier Metal CMP
• MEMS CMP, TSV CMP
• Polishing after Grinding Process